LM50, LM50-Q1

www.ti.com

SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013

TYPICAL CHARACTERISTICS (continued)

To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14.

Start-Up Response

Figure 13.

PRINTED CIRCUIT BOARD

A.

½

″ Square Printed Circuit Board with 2 oz. Foil or Similar

Figure 14. Printed Circuit Board Used

for Heat Sink to Generate All Curves

Mounting

The LM50/LM50-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It

can be glued or cemented to a surface and its temperature will be within about 0.2°C of the surface temperature.

This presumes that the ambient air temperature is almost the same as the surface temperature; if the air

temperature were much higher or lower than the surface temperature, the actual temperature of the LM50/LM50-

Q1 die would be at an intermediate temperature between the surface temperature and the air temperature.

To ensure good thermal conductivity the backside of the LM50/LM50-Q1 die is directly attached to the GND pin.

The lands and traces to the LM50/LM50-Q1 will, of course, be part of the printed circuit board, which is the object

whose temperature is being measured. These printed circuit board lands and traces will not cause the

LM50/LM50-Q1s temperature to deviate from the desired temperature.

Copyright © 1999–2013, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: LM50 LM50-Q1