ADM1275-3ARQZ-R7 datasheet(10/48 Pages) AD

10 / 48 page

ADM1275

Data Sheet

Rev. D | Page 10 of 48

Pin No.

QSOP

LFCSP

Mnemonic

Description

SDA

Serial Data Input/Output Pin. Open-drain input/output. Requires an external resistive pull-up.

SCL

Serial Clock Pin. Open-drain input. Requires an external resistive pull-up.

PWRGD

Power-Good Signal. Used to indicate that the supply is within tolerance. This signal is based on the

voltage present on the FLB pin.

FLB

Foldback Pin. A foldback resistor divider is placed from the source of the FET to this pin. Foldback is

used to reduce the current limit when the source voltage drops. The foldback feature ensures that

the power through the FET is not increased beyond the SOA limits.

VOUT

This pin is used to read back the output voltage using the internal ADC. A 1 kΩ resistor should be

inserted in series between the source of a FET and the VOUT pin.

GND

Chip Ground Pin.

GATE

Gate Output Pin. This pin is the high-side gate drive of an external N-channel FET. This pin is driven

by the FET drive controller, which uses a charge pump to provide a pull-up current to charge the FET

gate pin. The FET drive controller regulates to a maximum load current by regulating the GATE pin.

GATE is held low when the supply is below UVLO.

SENSE−

Negative Current Sense Input Pin. A sense resistor between the SENSE+ pin and the SENSE− pin sets

the analog current limit. The hot-swap operation of the ADM1275 controls the external FET gate to

maintain the sense voltage (VSENSE+ − VSENSE−). This pin also connects to the FET drain pin.

SENSE+

Positive Current Sense Input Pin. This pin connects to the main supply input. A sense resistor

between the SENSE+ pin and the SENSE− pin sets the analog current limit. The hot-swap operation

of the ADM1275 controls the external FET gate to maintain the sense voltage (VSENSE+ − VSENSE−). This

pin is also used to measure the supply input voltage using the ADC.

N/A

EPAD

Exposed Paddle on Underside of LFCSP. Solder the exposed paddle to the board to improve thermal

dissipation. The exposed paddle can be connected to ground.

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