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APL3203D датащи(PDF) 14 Page - Anpec Electronics Coropration

номер детали APL3203D
подробное описание детали  Li Charger Protection IC
PDF  19 Pages
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производитель  ANPEC [Anpec Electronics Coropration]
домашняя страница  http://www.anpec.com.tw
Logo ANPEC - Anpec Electronics Coropration

APL3203D датащи(HTML) 14 Page - Anpec Electronics Coropration

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Copyright
© ANPEC Electronics Corp.
Rev. A.6 - Mar., 2013
www.anpec.com.tw
14
APL3203D
Application Information
R
BAT Selection
Connect the BAT pin to the positive terminal of battery
through a resistor R
BAT for battery OVP function. The RBAT
limits the current flowing from BAT to battery in case of
BAT pin is shortened to VIN pin under a failure mode. The
recommended value of R
BAT is 100kΩ. In the worse case
of an IC failure, the current flowing from the BAT pin to the
battery is:
(30V-3V)/ 100k
Ω =270µA
where the 30V is the maximum IN voltage and the 3V is
the minimum battery voltage. The current is so small and
can be absorbed by the charger system.
The disadvantage with the large R
BAT is that the error of
the battery OVP threshold will be increased. The addi-
tional error is the voltage drop across the R
BAT because
of the BAT bias current. When R
BAT is 100kΩ, the worse-
case additional error is 100k
Ωx20nA=2mV, which is ac-
ceptable in most applications.
R
EN Selection
Since the IO voltage is divided by R
EN and EN internal pull
low resistor for EN voltage. It has to be ensured that the
EN voltage is above the EN logic high voltage when the
GPIO output of the MCU is high.
FAULTOutput
Since the FAULT pin is an open-drain output, connecting
a resistor R
UP to a pull high voltage is necessary. It is also
recommended that connect the FAULT to the MCU GPIO
through a resistor R
FAULT. The RFAULT prevents damage to
the MCU under a failure mode. The recommended value
of the resistors should be between 10k
Ω to 100kΩ.
Capacitor Selection
The input capacitor is for decoupling and prevents the
input voltage from overshooting to dangerous levels. In
the AC adapter hot plug-in applications or load current
step-down transient, the input voltage has a transient
spike due to the parasitic inductance of the input cable. A
25V, X5R, dielectric ceramic capacitor with a value be-
tween 1
µF and 4.7µF placed close to the IN pin is
recommended.
The output capacitor is for output voltage decoupling, and
also can be as the input capacitor of the charging circuit.
At least, a 1
µF, 10V, X5R capacitor is recommended.
For the same reason as the BAT pin case, the EN pin
should be connected to the MCU GPIO pin through a
resistor. The value of the R
EN is dependent on the IO
voltage of the MCU.
In some failure modes, a high voltage may be applied to
the device. Make sure the clearance constraint of the PCB
layout must satisfy the design rule for high voltage.
The exposed pad of the TDFN2x2-8 performs the func-
tion of channeling heat away. It is recommended that
connect the exposed pad to a large copper ground plane
on the backside of the circuit board through several ther-
mal vias to improve heat dissipation.
The input and output capacitors should be placed close
to the IC. R
ILIM also should be placed close to the IC.
The high current traces like input trace and output trace
must be wide and short.
Layout Consideration
BAT
Li+
Battery
EN
FAULT
MCU
R
UP
R
FAULT
R
EN
R
BAT
VIO
GPIO
GPIO
Figure 5. R
UP, RFAULT, REN and RBAT



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