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APL3203D датащи(PDF) 14 Page - Anpec Electronics Coropration |
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APL3203D датащи(HTML) 14 Page - Anpec Electronics Coropration |
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14 / 19 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.6 - Mar., 2013 www.anpec.com.tw 14 APL3203D Application Information R BAT Selection Connect the BAT pin to the positive terminal of battery through a resistor R BAT for battery OVP function. The RBAT limits the current flowing from BAT to battery in case of BAT pin is shortened to VIN pin under a failure mode. The recommended value of R BAT is 100kΩ. In the worse case of an IC failure, the current flowing from the BAT pin to the battery is: (30V-3V)/ 100k Ω =270µA where the 30V is the maximum IN voltage and the 3V is the minimum battery voltage. The current is so small and can be absorbed by the charger system. The disadvantage with the large R BAT is that the error of the battery OVP threshold will be increased. The addi- tional error is the voltage drop across the R BAT because of the BAT bias current. When R BAT is 100kΩ, the worse- case additional error is 100k Ωx20nA=2mV, which is ac- ceptable in most applications. R EN Selection Since the IO voltage is divided by R EN and EN internal pull low resistor for EN voltage. It has to be ensured that the EN voltage is above the EN logic high voltage when the GPIO output of the MCU is high. FAULTOutput Since the FAULT pin is an open-drain output, connecting a resistor R UP to a pull high voltage is necessary. It is also recommended that connect the FAULT to the MCU GPIO through a resistor R FAULT. The RFAULT prevents damage to the MCU under a failure mode. The recommended value of the resistors should be between 10k Ω to 100kΩ. Capacitor Selection The input capacitor is for decoupling and prevents the input voltage from overshooting to dangerous levels. In the AC adapter hot plug-in applications or load current step-down transient, the input voltage has a transient spike due to the parasitic inductance of the input cable. A 25V, X5R, dielectric ceramic capacitor with a value be- tween 1 µF and 4.7µF placed close to the IN pin is recommended. The output capacitor is for output voltage decoupling, and also can be as the input capacitor of the charging circuit. At least, a 1 µF, 10V, X5R capacitor is recommended. For the same reason as the BAT pin case, the EN pin should be connected to the MCU GPIO pin through a resistor. The value of the R EN is dependent on the IO voltage of the MCU. In some failure modes, a high voltage may be applied to the device. Make sure the clearance constraint of the PCB layout must satisfy the design rule for high voltage. The exposed pad of the TDFN2x2-8 performs the func- tion of channeling heat away. It is recommended that connect the exposed pad to a large copper ground plane on the backside of the circuit board through several ther- mal vias to improve heat dissipation. The input and output capacitors should be placed close to the IC. R ILIM also should be placed close to the IC. The high current traces like input trace and output trace must be wide and short. Layout Consideration BAT Li+ Battery EN FAULT MCU R UP R FAULT R EN R BAT VIO GPIO GPIO Figure 5. R UP, RFAULT, REN and RBAT |
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