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APL3202 датащи(PDF) 13 Page - Anpec Electronics Coropration |
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APL3202 датащи(HTML) 13 Page - Anpec Electronics Coropration |
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13 / 18 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.3 - Mar., 2012 APL3202 www.anpec.com.tw 13 Application Information Input and Output Capacitors Typically, a 4.7 µF ceramic capacitor is used to connect from VIN to GND. Place the capacitor as close as pos- sible to the VIN pin and GND pin for well operation. In some start-up conditions, it maybe necessary to protect the device against a hot plug input voltage. Adding a 6V input zener diode between the VIN pin and GND clamps the input voltage peak. In most applications, it is also recommended to connect an X5R ceramic capacitor (1 µF, typical) from BATT to GND for proper stability. STAT Pin The STAT pin can be used to drive a LED or communicate with the host processor to show the charge status. When the status is displayed by a LED, which has a current rating less than 5mA, a resistor should be selected to connect the LED in series, for programming at the de- sired current value. The resistor is calculated by the fol- lowing equation: LED ON - LED IN LED I ) V V ( R − = When STAT pin is monitored by a processor, there should be a 10k Ω to 100kΩ pull-up resistor to connect the STAT pin and the supply voltage of the processor. Thermal Consideration The most common measure of package thermal perfor- mance is thermal resistance measured from the device junction to the air surrounding the package surface ( θ JA). The θ JA can be calculated by the following equation: D A J JA P T T − = θ where: T J= device junction temperature, maximum TJ=120°C T A= ambient temperature P D= device power dissipation The device power dissipation, P D, is a function of the charge rate and the voltage drop across the internal FET. It can be calculated by the following equation: PCB Layout Consideration Connect the battery to BATT as close as possible to pro- vide accurate battery voltage sensing. The input and out- put decoupling capacitors and the programmed resistor R SET should be placed as close as possible to the device. The high-current charge paths into VIN and from the BATT pins must be short and wide to minimize voltage drops. Recommended Minimum Footprint 0.02 0.038 0.076 Unit : Inch SOT-23-5 CHG BATT IN D I ) V V ( P × − = |
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