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APL3202 датащи(PDF) 13 Page - Anpec Electronics Coropration

номер детали APL3202
подробное описание детали  Li Battery Charger with Thermal Regulation
PDF  18 Pages
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производитель  ANPEC [Anpec Electronics Coropration]
домашняя страница  http://www.anpec.com.tw
Logo ANPEC - Anpec Electronics Coropration

APL3202 датащи(HTML) 13 Page - Anpec Electronics Coropration

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Copyright
© ANPEC Electronics Corp.
Rev. A.3 - Mar., 2012
APL3202
www.anpec.com.tw
13
Application Information
Input and Output Capacitors
Typically, a 4.7
µF ceramic capacitor is used to connect
from VIN to GND. Place the capacitor as close as pos-
sible to the VIN pin and GND pin for well operation. In
some start-up conditions, it maybe necessary to protect
the device against a hot plug input voltage. Adding a 6V
input zener diode between the VIN pin and GND clamps
the input voltage peak. In most applications, it is also
recommended to connect an X5R ceramic capacitor (1
µF,
typical) from BATT to GND for proper stability.
STAT Pin
The STAT pin can be used to drive a LED or communicate
with the host processor to show the charge status. When
the status is displayed by a LED, which has a current
rating less than 5mA, a resistor should be selected to
connect the LED in series, for programming at the de-
sired current value. The resistor is calculated by the fol-
lowing equation:
LED
ON
-
LED
IN
LED
I
)
V
V
(
R
−
=
When STAT pin is monitored by a processor, there should
be a 10k
Ω to 100kΩ pull-up resistor to connect the STAT
pin and the supply voltage of the processor.
Thermal Consideration
The most common measure of package thermal perfor-
mance is thermal resistance measured from the device
junction to the air surrounding the package surface (
θ
JA).
The
θ
JA can be calculated by the following equation:
D
A
J
JA
P
T
T
−
=
θ
where:
T
J= device junction temperature, maximum TJ=120°C
T
A= ambient temperature
P
D= device power dissipation
The device power dissipation, P
D, is a function of the
charge rate and the voltage drop across the internal FET.
It can be calculated by the following equation:
PCB Layout Consideration
Connect the battery to BATT as close as possible to pro-
vide accurate battery voltage sensing. The input and out-
put decoupling capacitors and the programmed resistor
R
SET should be placed as close as possible to the device.
The high-current charge paths into VIN and from the BATT
pins must be short and wide to minimize voltage drops.
Recommended Minimum Footprint
0.02
0.038
0.076
Unit : Inch
SOT-23-5
CHG
BATT
IN
D
I
)
V
V
(
P
×
−
=



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