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APA2011 датащи(PDF) 26 Page - Anpec Electronics Coropration |
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APA2011 датащи(HTML) 26 Page - Anpec Electronics Coropration |
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26 / 27 page ![]() Copyright © ANPEC Electronics Corp. Rev. A.4 - Aug., 2013 www.anpec.com.tw 26 APA2011/2011A Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3 °C/second max. Liquidous temperature (TL) Time at liquidous (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body Temperature (Tp)* See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5 °C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Classification Profile |
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