TLP624,TLP624

−2,TLP624−4

2007-10-01

2

Rating

Characteristic

Symbol

TLP624

TLP624

−2

TLP624

−4

Unit

Forward current

60

50

mA

Forward current detating

−0.7(Ta ≥ 39°C) −0.5(Ta ≥ 25°C) mA / °C

Pulse forward current

1(100μs, pulse, 100pps)

A

Power dissipation(1 Circuit)

100

70

mW

Power dissipation derating

(Ta ≥ 25°C, 1 Circuit)

−1.0

−0.7

mW / °C

Reverse voltage

5

V

Junction temperature

125

°C

Collector

−emitter voltage

55

V

Emitter

−collector voltage

7

V

Collector current

50

mA

Collector power dissipation(1 circuit)

150

100

mW

Collector power dissipation derating

(Ta ≥ 25°C, 1 Circuit)

−1.5

−1.0

mW / °C

Junction temperature

125

°C

Storage temperature range

−55~125

°C

Operating temperature range

−55~100

°C

Lead soldering temperature

260(10s)

°C

Total package power dissipation(1 Circuit)

250

150

mW

Total package power dissipation derating

(Ta ≥ 25°C, 1 Circuit)

−2.5

−1.5

mW / °C

Isolation voltage

(Note 1)

5000(AC, 1min., RH≤60%)

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

(Note 1) Device considered a two terminal device: LED side pins shorted together, and detector side pins shorted

together.

Recommended Operating Conditions

Characteristic

Symbol

Min.

Typ.

Max.

Unit

Supply voltage

―

5

24

V

Forward current

―

1.6

20

mA

Collector current

―

1

10

mA

Operating temperature

−25

―

75

°C

Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the

device. Additionally, each item is an independent guideline respectively. In developing designs using this

product, please confirm specified characteristics shown in this document.