Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Apr., 2013

APW7301

www.anpec.com.tw

2

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Symbol

Parameter

Rating

Unit

VIN Supply Voltage (VIN to GND)

-0.3 ~ 30

V

LX to GND Voltage

V

EN, FB, COMP, SS to GND Voltage

-0.3 ~ 6

V

BS to GND Voltage

V

Power Dissipation

Internally Limited

W

Junction Temperature

150

Storage Temperature

-65 ~ 150

Maximum Lead Soldering Temperature, 10 Seconds

260

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in Free Air

(Note 2)

SOP-8P

75

θ

JC

Junction-to-Case Resistance in Free Air

(Note 3)

SOP-8P

15

Note 2:

θ

is soldered directly on the PCB.

Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-8P package.

APW7301

Handling Code

Temperature Range

Package Code

APW7301

XXXXX

Package Code

KA : SOP-8P

Temperature Range

I : -40 to 85

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device

APW7301 KA :

Assembly Material

XXXXX - Date Code