Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Oct., 2012

www.anpec.com.tw

2

APW7215

Symbol

Parameter

Rating

Unit

VIN Pin to GND

-0.3 to 7

V

FB and EN to GND

V

LX Pin to GND

-0.3 to 40

V

Power Dissipation

Internally Limit

W

Maximum Junction Temperature

150

°C

Storage Temperature Range

-65 to 150

°C

Maximum Lead Soldering Temperature, 10 Seconds

260

°C

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Junction-to-Ambient Resistance in free air (Note 2)

TDFN2x2-6

165

θ

JC

Junction-to-Case Resistance

TDFN2x2-6

20

Ordering and Marking Information

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability

Note 2:

θ

APW7215

Handling Code

Temperature Range

Package Code

Assembly Material

APW7215QB:

X - Date Code

W15

X

Package Code

QB: TDFN2x2-6

Operating Ambient Temperature Range

Handling Code

TR : Tape & Reel

Assembly Material

G : Halogen and Lead Free Device