Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Jun, 2011

APL5316

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

VIN Supply Voltage (VIN to GND)

-0.3 ~ 6.5

V

SHDN Input Voltage (SHDN to GND)

-0.3 ~ 6.5

V

Power Dissipation

Internally Limited

W

Junction Temperature

-40 ~ 150

°

C

Storage Temperature

-65 ~ 150

°

C

Maximum Lead Soldering Temperature, 10 Seconds

260

°

C

Absolute Maximum Ratings

Thermal Characteristics

Symbol

Parameter

Typical Value

Unit

θ

JA

Thermal Resistance-Junction to Ambient

(Note 1)

240

θ

JC

Thermal Resistance- Junction to Case

130

Note 2 :

θ

Recommended Operating Conditions

Symbol

Parameter

Range

Unit

VIN Supply Voltage

2.8 ~ 6

V

Output Voltage

Fixed Voltage

V

VOUT Output Current

0 ~ 300

mA

Output Capacitor

1.5 ~ 22

µF

Junction Temperature

-40 ~ 125

Simplified Application Circuits

VIN

GND

VOUT

POK

C

IN

3

2

1

5

4

APL5316

V

OUT

C

OUT

V

IN

POK

R

1

SHDN

VIN

SHDN

GND

VOUT

POK

C

IN

3

2

1

5

4

APL5316

V

OUT

C

OUT

V

IN

V

IN

POK

R

1

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability