EM3027

Copyright

 2013, EM Microelectronic-Marin SA

3027-DS.doc, Version 8.0, 25-Jan-13

2

www.emmicroelectronic.com

Table of contents

Table of contents ..................................................................................................................................................................... 2

1

Packages / Pin Out Configuration .................................................................................................................................... 3

2

Absolute Maximum Ratings.............................................................................................................................................. 4

2.1

Handling Procedures................................................................................................................................................. 4

2.2

Operating Conditions ................................................................................................................................................ 4

2.3

Crystal characteristics ............................................................................................................................................... 4

2.4

EEPROM Characteristics .......................................................................................................................................... 4

3

Electrical Characteristics .................................................................................................................................................. 4

4

EM3027 Block Diagram and Application Schematic......................................................................................................... 6

4.1

Block Diagram........................................................................................................................................................... 6

4.2

Application Schematic ............................................................................................................................................... 6

4.3

Crystal Thermal Behaviour........................................................................................................................................ 7

4.4

Crystal Calibration..................................................................................................................................................... 8

5

Memory Mapping.............................................................................................................................................................. 9

6

Definitions of terms in the memory mapping .................................................................................................................. 10

7

Serial communication ..................................................................................................................................................... 12

7.1

How to perform data transmission through I2C ....................................................................................................... 12

7.2

How to perform data transmission through SPI....................................................................................................... 13

8

Functional Description.................................................................................................................................................... 15

8.1

Start after power-up ................................................................................................................................................ 15

8.2

Normal Mode function ............................................................................................................................................. 15

8.3

Watch and Alarm function ....................................................................................................................................... 15

8.4

Timer function ......................................................................................................................................................... 16

8.5

Temperature measurement..................................................................................................................................... 16

8.6

Frequency compensation ........................................................................................................................................ 16

8.7

EEPROM memory................................................................................................................................................... 17

8.8

RAM User Memory.................................................................................................................................................. 18

8.9

Status Register........................................................................................................................................................ 18

8.10

Interrupts ............................................................................................................................................................ 18

8.11

Self-Recovery System (SRS) ............................................................................................................................. 19

8.12

Register Map ...................................................................................................................................................... 19

8.13

Crystal Oscillator and Prescaler ......................................................................................................................... 19

9

Power Management ................................................................................................................................................ 20

9.1

Power Supplies, Switchover and Trickle Charger ................................................................................................... 20

9.2

Low Supply Detection ............................................................................................................................................. 21

10

AC Characteristics .................................................................................................................................................. 22

10.1

AC characteristics

– I2C..................................................................................................................................... 22

10.2

I2C Specification compliance ............................................................................................................................. 23

10.3

AC characteristics

– SPI..................................................................................................................................... 24

11

Package Information ............................................................................................................................................... 26

11.1

TSSOP-08/14 ..................................................................................................................................................... 26

11.2

SO-8 ................................................................................................................................................................... 27

12

Ordering Information ............................................................................................................................................... 28