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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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USB2513 датащи(PDF) 54 Page - Microchip Technology |
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USB2513 датащи(HTML) 54 Page - Microchip Technology |
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54 / 63 page  USB 2.0 Hi-Speed Hub Controller Datasheet Revision 2.2 (02-17-12) 54 SMSC USB251xB/xBi DATASHEET 6.2.1 Package Thermal Specifications Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. The values provided are based on the package body, die size, maximum power consumption, 85°C ambient temperature, and 125°C junction temperature of the die. Table 6.9 Package Thermal Resistance Parameters Use the following formulas to calculate the junction temperature: TJ = P x ΘJA + TA TJ = P x ΨJT + TT SYMBOL USB2512B/12Bi USB2513B/13Bi USB2514B/14Bi ( °C/W) VELOCITY (meters/s) ΘJA 40.1 0 35.0 1 ΨJT 0.5 0 0.7 1 ΘJC 6.3 0 6.3 1 Table 6.10 Package Thermal Resistance Parameters SYMBOL USB2512B/12Bi USB2513B/13Bi USB2514B/14Bi ( °C/W) VELOCITY (meters/s) ΘJA 40.1 0 35.0 1 ΨJT 0.5 0 0.7 1 ΘJC 6.3 0 6.3 1 |
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