LP3987 datasheet(3/21 Pages) TI

3 / 21 page

LP3987

www.ti.com

SNVS164G – OCTOBER 2001 – REVISED MAY 2013

ORDERING INFORMATION(1)(2)

DSBGA Package

LP3987 Supplied as 250 Units

LP3987 Supplied as 3000 Units

Output Voltage

Grade

Tape and Reel

2.5V

LP3987ITL-2.5

LP3987ITLX-2.5

2.6V

LP3987ITL-2.6

LP3987ITLX-2.6

2.8V

STD

LP3987ITL-2.8

LP3987ITLX-2.8

2.85V

LP3987ITL-2.85

LP3987ITLX-2.5

3.0V

LP3987ITL-3.0

LP3987ITLX-3.0

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3)

VIN

−0.3 to 6.5V

VEN, VMODE

−0.3 to 6.5V

VOUT

−0.3V to(V IN+ 0.3V) ≤ 6.5

Storage Temperature

−65°C to +150°C

ESD (4)

Human Body Model

2KV

Machine Model

200V

Maximum Power Dissipation (5)

θJA (DSBGA small bump)

255°C/W

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact theTI Sales Office/Distributors for availability and specifications.

(4)

The human body model is 100pF discharged through 1.5k

Ω.

(5)

The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula:PD = (TJ -

TA)/θJA,Where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. For

instant, if VIN in target application is 4.2V and worse case current consumption is 90mA. Therefore PMAX_DISSIPATION = (4.2-2.7)*0.09

=135mW. With PMAX_DISSIPATION is 135mW, TJmax is 125°C and worse case ambient temperature (TA ) in target application is 85°C, θJA

= (125-85)/0.135 = 296°C/W.

Operating Ratings

(1) (2)

VIN

VOUT+ 200mV to 6V

VEN, VMODE

0 to 6.0V

Junction Temperature

−40°C to +125°C

Maximum Power Dissipation (3)

392mW at 25°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula:PD = (TJ -

TA)/θJA,Where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. For

instant, if VIN in target application is 4.2V and worse case current consumption is 90mA. Therefore PMAX_DISSIPATION = (4.2-2.7)*0.09

=135mW. With PMAX_DISSIPATION is 135mW, TJmax is 125°C and worse case ambient temperature (TA ) in target application is 85°C, θJA

= (125-85)/0.135 = 296°C/W.

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