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©2012 Littelfuse, Inc.

Specifications are subject to change without notice.

Revision: March 20, 2012

SP050xBA Lead-Free/Green Series

General Purpose ESD Protection - SP05 Series

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

- Temperature Min (T

150°C

- Temperature Max (T

200°C

- Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

5°C/second max

T

5°C/second max

Reflow

- Temperature (T

217°C

- Temperature (t

60 – 150 seconds

Peak Temperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peak Temperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Package Dimensions — SOT143

503B

E

E1

c

e

e1

1

2

4

3

b2

b

A1

A

D

L

L1

SP0503BAHTG - SOT143-4

Package

SOT143-4

Pins

4

JEDEC

TO-253

Millimeters

Inches

Min

Max

Min

Max

A

0.8

1.22

0.03

0.048

A1

0.05

0.15

0.002

0.006

b

0.30

0.50

0.012

0.020

b2

0.76

0.89

0.030

0.035

c

0.08

0.20

0.003

0.008

D

2.80

3.04

0.110

0.120

E

2.10

2.64

0.082

0.104

E1

1.20

1.40

0.047

0.055

e

1.92 BSC

0.076 BSC

e1

0.20 BSC

0.008 BSC

L

0.4

0.6

0.016

0.024

L1

0.550 REF

0.022 REF

3.40 (.134")

3.60 (.140")

0.80 (.032")

1.00 (.040")

2.20

(.087")

REF

1.90

(.075")

1.70

(.067")

1.00 (.040")

1.20 (.048")

0.80 (.032")

1.00 (.040")

BSC

MAX

1.40 (.055")

Recommended Pad Layout