TPS2513, TPS2513A

TPS2514, TPS2514A

SLVSBY8B – MAY 2013 – REVISED SEPTEMBER 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

For the most current package and ordering information, see the Package Option Addendum at the end of this

document, or see the TI web site at www.ti.com.

Table 1. Product Information

CHARGING SCHEMES (DCP_AUTO)

1.2V mode

BC1.2 and YD/T

NUMBER OF

DEVICE

(D+/D- shorted and

1591-2009 mode

Divider 1

Divider 2

Divider 3

CONTROLLER

bias to 1.2V)

(D+/D- shorted)

(D+/D- = 2V/2.7V)

(D+/D- = 2.7V/2V)

(D+/D- = 2.7V/2.7V)

TPS2513

Dual

Yes

(1)

Yes

No

TPS2514

Single

Yes

(1)

Yes

No

Yes

Yes

TPS2513A

Dula

No

No

Yes

TPS2514A

Single

No

No

Yes

(1)

See to Figure 14.

ABSOLUTE MAXIMUM RATINGS

(1)

Over recommended junction temperature range, voltages are referenced to GND (unless otherwise noted)

MIN

MAX

UNIT

IN

–0.3

7

Voltage range

DP1, DP2 output voltage, DM1, DM2 output voltage

–0.3

5.8

V

DP1, DP2 input voltage, DM1, DM2 input voltage

–0.3

5.8

Continuous output sink current

DP1, DP2 input current, DM1, DM2 input current

35

mA

Continuous output source

DP1, DP2 output current, DM1, DM2 output current

35

mA

current

IN

2

Human Body Model

kV

(HBM)

ESD rating

DP1, DP2, DM1, DM2

6

Charging Device Model (CDM)

500

V

–40

125

°C

Storage Temperature Range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

DBV (6 PINS)

UNITS

Junction-to-ambient thermal resistance

179.9

Junction-to-case (top) thermal resistance

117.5

Junction-to-board thermal resistance

41.9

°C/W

Junction-to-top characterization parameter

17.2

Junction-to-board characterization parameter

41.5

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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