registered trademarks of Cree, Inc.

2

xlamp mC-e leds

characteristics - comPlete Package

The following table lists the product characteristics for the XLamp mC-e LeD package.

characteristics

unit

minimum

typical

maximum

Thermal Resistance, junction to solder point - white

°C/w

3

Thermal Resistance, junction to solder point - color

°C/w

4

viewing Angle (FwHm) - white

degrees

110

viewing Angle (FwHm) - color

degrees

115

eSD withstand voltage (HBm per mil-Std-883D)

v

8000

LED Junction Temperature

°C

150

characteristics - Per led die (White, easyWhite, dynamic White)

The following table lists the product characteristics of each individual LeD die within the XLamp mC-e white LeD package.

characteristics

unit

minimum

typical

maximum

Temperature Coefficient of Voltage

mv/°C

-4

DC Forward Current

mA

700

Reverse voltage

v

5

Forward voltage (@ 350 mA)

v

3.1

3.9

Forward voltage (@ 700 mA)

v

3.4

characteristics - Per led die (color)

The following table lists the product characteristics for each LeD die within the XLamp mC-e Color LeD package.

characteristics

unit

red

green

blue

White

Temperature Coefficient of Voltage

mv/°C

Typical

-2

-4

-4

-4

DC Forward Current

mA

maximum

700

700

700

700

Reverse voltage

v

maximum

5

5

5

5

Forward voltage (@ 350 mA)

v

Typical

2.1

3.4

3.2

3.1

maximum

2.5

3.9

3.9

3.9

Forward voltage (@ 700 mA)

v

Typical

2.3

3.7

3.5

3.5