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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADL5592ACPZ-R71 датащи(PDF) 19 Page - Analog Devices |
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ADL5592ACPZ-R71 датащи(HTML) 19 Page - Analog Devices |
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19 / 20 page  ADL5592 Rev. 0 | Page 19 of 20 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-2 1 0.50 BSC TOP VIEW BOTTOM VIEW INDEX AREA 6.00 BSC SQ 40 11 20 21 30 31 10 EXPOSED PAD PIN 1 INDICATOR 4.25 4.15 SQ 4.00 0.50 0.40 0.30 0.20 MIN SEATING PLANE 0.80 0.75 0.70 0.30 0.25 0.18 0.05 MAX 0.02 NOM 0.20 REF THE EXPOSED METAL PADDLE ON THE BOTTOM OF THE LFCSP PACKAGE MUST BE SOLDERED TO PCB GROUND FOR PROPER HEAT DISSIPATION AND ALSO FOR NOISE AND MECHANICAL STRENGTH BENEFITS. Figure 27. 40-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 6 mm × 6 mm Body, Very Very Thin Quad (CP-40-2) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Ordering Quantity ADL5592ACPZ-R71 −40°C to +85°C 40-Lead LFCSP_WQ, 7" Tape and Reel CP-40-2 3,000 ADL5592-EVALZ1 Evaluation Board 1 Z = RoHS Compliant Part. |
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