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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPC8247VR датащи(PDF) 56 Page - Freescale Semiconductor, Inc |
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MPC8247VR датащи(HTML) 56 Page - Freescale Semiconductor, Inc |
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56 / 61 page  MPC8272 PowerQUICC II Family Hardware Specifications, Rev. 3 56 Freescale Semiconductor Package Description 9 Package Description This figure shows the side profile of the PBGA package to indicate the direction of the top surface view. Figure 13. Side View of the PBGA Package Remove 9.1 Package Parameters This table provides package parameters. NOTE: Temperature Reflow for the VR Package In the VR package, sphere composition is lead-free (see Table 2). This requires higher temperature reflow than what is required for other PowerQUICC II packages. Consult “Freescale PowerQUICC II Pb-Free Packaging Information” (MPC8250PBFREEPKG) available on www.freescale.com. Table 22. Package Parameters Code Type Outline (mm) Interconnects Pitch (mm) Nominal Unmounted Height (mm) VR, ZQ PBGA 27 x 27 516 1 2.25 Die Transfer molding compound 1 mm pitch Wire bonds attach DIE Ball bond Screen-printed solder mask Cu substrate traces Resin glass epoxy Plated substrate via |
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