ADM3202/ADM3222/ADM1385

Rev. E | Page 13 of 16

COMPLIANT TO JEDEC STANDARDS MO-153-AC

20

1

11

10

6.40 BSC

4.50

4.40

4.30

PIN 1

6.60

6.50

6.40

SEATING

PLANE

0.15

0.05

0.30

0.19

0.65

BSC

1.20 MAX

0.20

0.09

0.75

0.60

0.45

8°

0°

COPLANARITY

0.10

Figure 26. 20-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-20)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-013-AB

0.30 (0.0118)

0.10 (0.0039)

2.65 (0.1043)

2.35 (0.0925)

10.65 (0.4193)

10.00 (0.3937)

7.60 (0.2992)

7.40 (0.2913)

0.75 (0.0295)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

COPLANARITY

0.10

0.33 (0.0130)

0.20 (0.0079)

0.51 (0.0201)

0.31 (0.0122)

SEATING

PLANE

8°

0°

18

10

9

1

1.27

(0.0500)

BSC

11.75 (0.4626)

11.35 (0.4469)

45°

Figure 27. 18-Lead Standard Small Outline Package [SOIC_W]

Wide Body

(RW-18)

Dimensions shown in millimeters and (inches)