Micrel, Inc.

MIC2870

September 5, 2013

2

Revision 1.0

Ordering Information

Part Number

Marking

Temperature Range

Package

Lead Finish

MIC2870YFT

70H

–40

°C to +125°C

16-Pin 2mm × 2mm TQFN

NiPdAu

Note:

1.

Package is a GREEN, RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free.

2.

Thin QFN pin 1 identifier = “

Pin Configuration

16-Pin 2mm × 2mm TQFN

(Top View)

Pin Description

Pin Number

Pin Name

Pin Function

1

SCL

High-Speed Mode (3.4MHz) I²C Clock Input.

2

VIN

Supply Input. Connect a low-ESR ceramic capacitor of at least 4.7µF to PGND. A small capacitor

of 100nF between VIN and AGND is highly recommended.

3

FEN

Flash-Mode Enable Pin. A LOW-to-HIGH transition initiates the flash mode and flash-mode timer.

If FEN is left floating, it is pulled-down internally by a built-in 1µA current source when the device

is enabled.

4

FI

Flash Inhibit. When FI is pulled HIGH, both LED currents are changed from the flash-mode

current level to the torch-mode current level. If FI is left floating, it is pulled-down internally by a

built-in 1µA current source when the device is enabled. This function is generally used to reduce

instantaneous battery load current by synchronizing with the handset’s GSM pulse off time.

5

FRSET

Flash-Mode Current Level Programming. Connect a resistor from FRSET to AGND to set the

maximum current in the flash m

ode. For example, a 10kΩ resistor sets the LED sink current to its

maximum value of 750mA per channel. FRSET can be grounded if the default maximum flash-

mode current (750mA) is desired. FRSET, however, cannot be left floating and the maximum

resistance is

limited to 80kΩ

6

AGND

Analog Ground. Reference ground for FRSET and TRSET pins.