PCF8564AU datasheet(2/48 Pages) NXP

номер детали	PCF8564AU

подробное описание детали	Real time clock and calendar

PDF	48 Pages

Scroll/Zoom	100%

производитель	NXP [NXP Semiconductors]

домашняя страница	http://www.nxp.com

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2 / 48 page

PCF8564A

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 26 August 2013

2 of 48

NXP Semiconductors

PCF8564A

Real time clock and calendar

Ordering information

4.1 Ordering options

[1]

Bump hardness, see Table 36.

Marking

Table 1.

Ordering information

Type number

Package

Name

Description

Version

PCF8564AU

bare die

wire bond die; 9 bonding pads

PCF8564AU

PCF8564AUG

bare die

9 bumps

PCF8564AUG

Table 2.

Ordering options

Product type number

Sales item (12NC)

Orderable part number

revision

Delivery form

PCF8564AU/10AB/1

935289478005

PCF8564AU/10AB/1,0

wafer, sawn, on FFC

PCF8564AU/5BB/1

935289319015

PCF8564AU/5BB/1,01

unsawn wafer

PCF8564AU/5GB/1

935289477015

PCF8564AU/5GB/1,01

unsawn wafer

PCF8564AU/5GC/1

935293569015

PCF8564AU/5GC/1,01

unsawn wafer

PCF8564AUG/12HB/1

935301011005

PCF8564AUG/12HB/1V

wafer, sawn, on 8 inch metal

FFC; chips with soft bumps[1]

Table 3.

Marking codes

Type number

Marking code

PCF8564AU

PC8564A-1

PCF8564AUG

PC8564A-1

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