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8940 датащи(PDF) 3 Page - 3M Electronics

номер детали 8940
подробное описание детали  3M™ Thermally Conductive Adhesive Tape 8940 / 8943
PDF  4 Pages
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производитель  3M [3M Electronics]
домашняя страница  http://www.3m.com
Logo 3M - 3M Electronics

8940 датащи(HTML) 3 Page - 3M Electronics

  8940 Datasheet HTML 1Page - 3M Electronics 8940 Datasheet HTML 2Page - 3M Electronics 8940 Datasheet HTML 3Page - 3M Electronics 8940 Datasheet HTML 4Page - 3M Electronics  
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3M
™ Thermally Conductive Adhesive Tapes 8940 / 8943
3/4
Thermal
Resistance
Properties
Test
Unit
Value
Test Method
Thermal Gravimetric Analysis *
Mass loss at 200 °C
%
< 0,2
Mass loss at 150 °C after 4 h
%
< 0,3
3M
Flame Class:
UL 94 V-0, File E253171, Flame rating applies to adhesive film (3M
TM Thermally
conductive Tape 8940) bonded to 3.0 mm minimum thickness aluminium on one side and
0.86 mm minimum thickness FR-4 laminate on other side.
Application
Guidelines
1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol
(isopropanol) applied with a lint-free wipe or swab should be adequate for removing
surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass
cleaners which often contain oily components. Allow the surface to dry for several minutes
before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone
(MEK) or heptane) may be required to remove heavier contamination (grease, machine oils,
solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using
primers and solvents.
2) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller
pressure to help reduce the possibility of air entrapment under the tape during its
application. The liner can be removed after positioning the tape onto the first substrate.
3) Assemble the part by applying compression to the substrates to ensure a good wetting of
the substrate surfaces with the tape. Proper application of pressure (amount of pressure,
time applied, temperature applied) will depend upon design of the parts. The preferred pressure at
room temperature is a minimum of 1 kg/cm
2 for 5 seconds. For fragile parts lower pressure may be
needed.
Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat.
Flexible substrates can be bonded to rigid or flexible parts with much less concern about air
entrapment because one of the flexible substrates can conform to the other substrate.
Shelf Life
Product shelf life is 2 years from date of manufacture when stored at room temperature
conditions 22°C and 50% r.h. in the products original packaging.



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