Rev 16.0

31

PD-97509

IR3843AMPbF

Solder Resist

It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder

resist should be pulled away from the metal lead lands by a minimum of 0.025mm to ensure

NSMD pads.

The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder

resist onto the copper of 0.05mm to accommodate solder resist mis-alignment.

Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due

to the high aspect ratio of the solder resist strip separating the lead lands from the pad land.