SCA720-D01

Murata Electronics Oy

12/13

www.muratamems.fi

Doc. nr. 82171500

Rev.A

3.2.

Reflow soldering

The SCA720 is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with

normal SMD pick-and-place equipment. Recommended body temperature profile during reflow

soldering:

Figure 10.

Recommended body temperature profile during reflow soldering. Ref.

IPC/JEDEC J-STD-020D.

Profile feature

Sn-Pb Eutectic

Assembly

Pb-free Assembly

3 °C/second max.

3 °C/second max.

Preheat

-

-

-

Time (min to max) (ts)

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-180 seconds

-

Ramp up rate

3°C/second max

Time maintained above:

-

-

183 °C

60-150 seconds

217 °C

60-150 seconds

240 +0/−5 °C

250 +0/−5 °C

Time within 5 °C of actual Peak Temperature

10-30 seconds

20-40 seconds

Ramp-down rate

6 °C/second max

6 °C/second max

Time 25 °C to Peak temperature

6 minutes max

8 minutes max

The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020D. The

part should be delivered in a dry pack. The manufacturing floor time (out of bag) in the

customer’s end is 168 hours.