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Vishay Siliconix

Revision: 10-Oct-11

1

Document Number: 63459

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

WCSP4: 4 Bumps

(2 x 2 , 0.4 mm pitch, 208 μm bump height, 0.8 mm x 0.8 mm die size)

Notes

Note

a. Use millimeters as the primary measurement.

MILLIMETERSa

INCHES

DIM.

MIN.

NOM.

MAX.

MIN.

NOM.

MAX.

A

0.515

0.530

0.545

0.0202

0.0208

0.0214

A1

0.208

0.0081

b

0.250

0.260

0.270

0.0098

0.0102

0.0106

e

0.400

0.0157

D

0.720

0.760

0.800

0.0182

0.0193

0.0203

4 x Ø b

Bump Note 2

A

B

Pin 1 mark

W

B

A

12

1

2

A

B

Mark on backside of die

e

D

ECN: T11-0497-Rev. B, 10-Oct-11

DWG: 6004