3

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100)

Figure 1. Solder Reflow Thermal Profile.

Solder Reflow Thermal Profile

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

0.635 ± 0.25

(0.025 ± 0.010)

12° NOM.

9.65 ± 0.25

(0.380 ± 0.010)

0.635 ± 0.130

(0.025 ± 0.005)

7.62 ± 0.25

(0.300 ± 0.010)

5

6

7

8

4

3

2

1

9.65 ± 0.25

(0.380 ± 0.010)

6.350 ± 0.25

(0.250 ± 0.010)

1.080 ± 0.320

(0.043 ± 0.013)

1.780

(0.070)

MAX.

1.19

(0.047)

MAX.

2.54

(0.100)

BSC

0.254

+ 0.076

- 0.051

(0.010

+ 0.003)

- 0.002)

1.016 (0.040)

1.27 (0.050)

10.9 (0.430)

2.0 (0.080)

LAND PATTERN RECOMMENDATION

3.56 ± 0.13

(0.140 ± 0.005)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

Note: Non-halide flux should be used.