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IRFS4115TRLPBF датащи(PDF) 2 Page - International Rectifier

номер детали IRFS4115TRLPBF
подробное описание детали  High Efficiency Synchronous Rectification in SMPS
PDF  9 Pages
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производитель  IRF [International Rectifier]
домашняя страница  http://www.irf.com
Logo IRF - International Rectifier

IRFS4115TRLPBF датащи(HTML) 2 Page - International Rectifier

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IRFS/SL4115PbF
2
www.irf.com
S
D
G
Notes:
 Calculated continuous current based on maximum allowable junction
temperature. Bond wire current limit is 195A. Note that current
limitations arising from heating of the device leads may occur with
some lead mounting arrangements.
(Refer to AN-1140)
‚ Repetitive rating; pulse width limited by max. junction
temperature.
ƒ Recommended max EAS limit, starting TJ = 25°C,
L = 0.17mH, RG = 25Ω, IAS = 100A, VGS =15V.
„ ISD ≤ 62A, di/dt ≤ 1040A/μs, VDD ≤ V(BR)DSS, TJ ≤ 175°C.
… Pulse width ≤ 400μs; duty cycle ≤ 2%.
† Coss eff. (TR) is a fixed capacitance that gives the same charging time
as Coss while VDS is rising from 0 to 80% VDSS.
‡ Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
ˆ When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering techniques refer to application note #AN-994.
‰ Rθ is measured at TJ approximately 90°C.
Š RθJC value shown is at time zero.
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
V(BR)DSS
Drain-to-Source Breakdown Voltage
150
–––
–––
V
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient
–––
0.18
–––
V/°C
RDS(on)
Static Drain-to-Source On-Resistance
–––
10.3
12.1
m
Ω
VGS(th)
Gate Threshold Voltage
3.0
–––
5.0
V
IDSS
Drain-to-Source Leakage Current
–––
–––
20
μA
–––
–––
250
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
nA
Gate-to-Source Reverse Leakage
–––
–––
-100
RG
Internal Gate Resistance
–––
2.3
–––
Ω
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
gfs
Forward Transconductance
97
–––
–––
S
Qg
Total Gate Charge
–––
77
120
nC
Qgs
Gate-to-Source Charge
–––
28
–––
Qgd
Gate-to-Drain ("Miller") Charge
–––
26
–––
Qsync
Total Gate Charge Sync. (Qg - Qgd)
–––
51
–––
td(on)
Turn-On Delay Time
–––
18
–––
ns
tr
Rise Time
–––
73
–––
td(off)
Turn-Off Delay Time
–––
41
–––
tf
Fall Time
–––
39
–––
Ciss
Input Capacitance
–––
5270
–––
pF
Coss
Output Capacitance
–––
490
–––
Crss
Reverse Transfer Capacitance
–––
105
–––
Coss eff. (ER) Effective Output Capacitance (Energy Related) –––
460
–––
Coss eff. (TR) Effective Output Capacitance (Time Related)
–––
530
–––
Diode Characteristics
Symbol
Parameter
Min. Typ. Max. Units
IS
Continuous Source Current
–––
–––
99
A
(Body Diode)
ISM
Pulsed Source Current
–––
–––
396
A
(Body Diode)
Ãd
VSD
Diode Forward Voltage
–––
–––
1.3
V
trr
Reverse Recovery Time
–––
86
–––
ns
TJ = 25°C
VR = 130V,
–––
110
–––
TJ = 125°C
IF = 62A
Qrr
Reverse Recovery Charge
–––
300
–––
nC TJ = 25°C
di/dt = 100A/μs
g
–––
450
–––
TJ = 125°C
IRRM
Reverse Recovery Current
–––
6.5
–––
A
TJ = 25°C
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Conditions
VDS = 50V, ID = 62A
ID = 62A
VGS = 20V
VGS = -20V
MOSFET symbol
showing the
VDS = 75V
Conditions
VGS = 10V g
VGS = 0V
VDS = 50V
ƒ = 1.0 MHz, See Fig. 5
VGS = 0V, VDS = 0V to 120V i, See Fig. 11
VGS = 0V, VDS = 0V to 120V h
TJ = 25°C, IS = 62A, VGS = 0V g
integral reverse
p-n junction diode.
Conditions
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 3.5mAd
VGS = 10V, ID = 62A g
VDS = VGS, ID = 250μA
VDS = 150V, VGS = 0V
VDS = 150V, VGS = 0V, TJ = 125°C
ID = 62A
RG = 2.2Ω
VGS = 10V g
VDD = 98V
ID = 62A, VDS =0V, VGS = 10V



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