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MF-USMF датащи(PDF) 2 Page - Bourns Electronic Solutions

номер детали MF-USMF
подробное описание детали  MF-USMF Series - PTC Resettable Fuses PC motherboards Digital cameras
PDF  4 Pages
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производитель  BOURNS [Bourns Electronic Solutions]
домашняя страница  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

MF-USMF датащи(HTML) 2 Page - Bourns Electronic Solutions

  MF-USMF Datasheet HTML 1Page - Bourns Electronic Solutions MF-USMF Datasheet HTML 2Page - Bourns Electronic Solutions MF-USMF Datasheet HTML 3Page - Bourns Electronic Solutions MF-USMF Datasheet HTML 4Page - Bourns Electronic Solutions  
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Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-USMF Series - PTC Resettable Fuses
Product Dimensions
DIMENSIONS:
MM
(INCHES)
Model
AB
C
D
Min.
Max.
Min.
Max.
Min.
Max.
Min.
MF-USMF005
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF010
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF020
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF035
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF050
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF075
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF110
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF150
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
MF-USMF175X
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
Packaging: 3000 pcs. per reel.
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
A
B
C
Top and Bottom View
Side View
D
160–220
300
250
200
150
100
50
0
10–20
120
Preheating
Soldering
Cooling
Time (seconds)
Solder Reflow Recommendations
Notes:
MF-USMF models cannot be wave soldered.
If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse® Polymer PTC Soldering
Recommendation guidelines.
Recommended Pad Layout
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)



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