LM3263

SNVS837 – JUNE 2013

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Table 3. Suggested Capacitors and Their Suppliers

Capacitance

Model

Size (WxL) (mm)

Vendor

10 µF

GRM185R60J106M

1.6 x 0.8

Murata

10 µF

CL05A106MP5NUN

1.0 x 0.5

Samsung

4.7 µF

CL05A475MP5NRN

1.0 x 0.5

Samsung

1.0 µF

CL03A105MP3CSN

0.6 x 0.3

Samsung

1.0 µF

C0603X5R0J105M

0.6 x 0.3

TDK

3300 pF

GRM022R60J332K

0.4 x 0.2

Murata

DSBGA Package Assembly And Use

Use of the DSBGA package requires specialized board layout, precision mounting, and careful re-flow

techniques, as detailed in Texas Instruments Application Note 1112 (SNVA009). Refer to the section Surface

Mount Technology (SMD) Assembly Considerations. For best results in assembly, alignment ordinals on the PC

board should be used to facilitate placement of the device. The pad style used with DSBGA package must be the

NSMD (non-solder mask defined) type. This means that the solder-mask opening is larger than the pad size.

This prevents a lip that otherwise forms if the solder-mask and pad overlap from holding the device off the

surface of the board and interfering with mounting. See Application Note 1112 for specific instructions how to do

this.

The 16-bump package used for the LM3263 has 265 micron (nominal) solder balls and requires 0.225 mm pads

for mounting the circuit board. The trace to each pad should enter the pad with a 90º entry angle to prevent

debris from being caught in deep corners. Initially, the trace to each pad should be about 0.142 mm wide, for a

section approximately 0.127 mm long, as a thermal relief. Then each trace should neck up or down to its optimal

width.

An important criterion is symmetry to insure the solder bumps on the LM3263 re-flow evenly and that the device

solders level to the board. In particular, special attention must be paid to the pads for bumps A1, A3, B1, and B3

since PGND, PVIN and BGND are typically connected to large copper planes; inadequate thermal relief can

result in inadequate re-flow of these bumps.

The DSBGA package is optimized for the smallest possible size in applications with red-opaque or infrared-

opaque cases. Because the DSBGA package lacks the plastic encapsulation characteristic of larger devices, it is

vulnerable to light. Backside metallization and/or epoxy coating, along with front-side shading by the printed

circuit board, reduce this sensitivity. However, the package has exposed die edges that are sensitive to light in

the red and infrared range shining on the package’s exposed die edges.

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