© 2011 Rochester Electronics, LLC

Page 2

July 2011

All Rights Reserved

 

Executive Summary

Semiconductor end-of-life is an ever-present problem in every electronics manufacturing industry today, and it’s

not going away. The goal has always been to purchase a replacement that is the exact form, fit, and function as

the original. Lately, companies have been offering a variety to aftermarket “substitute” solutions they claim to be

form, fit, and function replacements; however, manufacturers are finding from experience that these parts often

fall far short of that promise.

Logistically as well as technically, these substitutes are incomplete, short-lived patches rather than

comprehensive, permanent solutions. Throughout the semiconductor industry, in this consumer-driven

semiconductor economy, the life expectancy of any component – these substitutes included – is usually less than

three years. Obsolescence is always right around the corner.

This paper will discuss some of the substitute solutions available and demonstrate how Rochester Electronics’

Extension-of-Life

by the original manufacture to have the exact form, fit, and function of the originals.

The recommended end-of-life strategy

 

Usually the most expeditious and economical response to an end-of-life notice is to make a last-time buy (LTB) …

to stockpile the number of components necessary for the life of the program. At a bare minimum, an LTB of the

semiconductor wafer-level product should be made. However, that is not always possible. Sometimes inventory

just is not available. Sometimes manufacturers miss the “window of opportunity.” Sometimes manufacturers do

not have the financing necessary to make the large, single-order purchase. Or they don’t have the facilities to

safely store the inventory if they could obtain it.

As for purchasing the components on an as-needed basis, manufactures are constantly warned to avoid

counterfeit and substandard replacement parts by buying only from the original manufacturer or their authorized

distributors. Availability can be a problem.

 

Substitute options may not provide exact form, fit, and functional

replacements

 

The most commonly offered substitute solutions to support ongoing functional needs of discontinued

semiconductors are:

Emulation – An integrated circuit manufactured using a customized, pre-prepared silicon die. It is

manufactured using a silicon technology different from the one used on the original part, and is modified

to demonstrate operational functionality similar to that of the original semiconductor. An emulation

simulates or mimics the functionality of the original. Emulation is expensive, and almost always requires a

lengthy and expensive trial-and-error foundry process, which is usually not included the initial cost

estimate. Ultimately, emulated parts must be fully re-qualified because the emulation environment simply

cannot repeat the system environment for timing, noise sensitivities, power, handling, and functionality.

Note: MIL-M-38510 specification required that emulated parts must have different part numbers than the

original devices.

ASIC – An application-specific integrated circuit that is customized for a particular use, rather than

intended for general-purpose use. In order to be used as a replacement part, ASIC components must be

fully customized for end use by a semiconductor manufacturer using their commercial process to replicate

the electrical functionality of the original semiconductor. The manufacturing process for ASIC components

can be very expensive compared to the cost of some the other approaches. An ASIC approach to

obsolescence is done using gate array or standard cell technologies and methodologies.