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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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AD5204BRUZ100-R7 датащи(PDF) 18 Page - Analog Devices |
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AD5204BRUZ100-R7 датащи(HTML) 18 Page - Analog Devices |
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18 / 20 page  AD5204/AD5206 Rev. C | Page 18 of 20 24 13 12 1 6.40 BSC 4.50 4.40 4.30 PIN 1 7.90 7.80 7.70 0.15 0.05 0.30 0.19 0.65 BSC 1.20 MAX 0.20 0.09 0.75 0.60 0.45 8° 0° SEATING PLANE 0.10 COPLANARITY COMPLIANT TO JEDEC STANDARDS MO-153-AD Figure 37. 24-Lead Thin Shrink Small Outline Package [TSSOP] (RU-24) Dimensions shown in millimeters COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2 0.30 0.23 0.18 0.20 REF 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 12° MAX 1.00 0.85 0.80 SEATING PLANE COPLANARITY 0.08 1 32 8 9 25 24 16 17 0.50 0.40 0.30 3.50 REF 0.50 BSC PIN 1 INDICATOR TOP VIEW 5.00 BSC SQ 4.75 BSC SQ 3.45 3.30 SQ 3.15 PIN 1 INDICATOR 0.60 MAX 0.60 MAX 0.25 MIN EXPOSED PAD (BOTTOM VIEW) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 5 mm × 5 mm Body, Very Thin Quad (CP-32-3) Dimensions shown in millimeters ORDERING GUIDE Model1, 2 kΩ Temperature Range Package Description Package Option AD5204BN10 10 −40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1 AD5204BR10 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 AD5204BR10-REEL 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 AD5204BRZ10 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 AD5204BRZ10-REEL 10 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 AD5204BRU10 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24 AD5204BRU10-REEL7 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24 AD5204BRUZ10 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24 AD5204BRUZ10-REEL7 10 −40°C to +85°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24 AD5204BCPZ10-REEL 10 −40°C to +85°C 32-Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-3 AD5204BCPZ10-REEL7 10 −40°C to +85°C 32-Lead Frame Chip Scale Package [LFCSP_VQ] CP-32-3 AD5204BN50 50 −40°C to +85°C 24-Lead Plastic Dual In-Line Package [PDIP] N-24-1 AD5204BR50 50 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 AD5204BR50-REEL 50 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 AD5204BRZ50 50 −40°C to +85°C 24-Lead Standard Small Outline Package [SOIC_W] RW-24 |
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