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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADP170AUJZ-2.8-R7 датащи(PDF) 16 Page - Analog Devices |
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ADP170AUJZ-2.8-R7 датащи(HTML) 16 Page - Analog Devices |
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16 / 20 page  ADP170/ADP171 Rev. B | Page 16 of 20 J1 ANALOG DEVICES ADP171-x.x-EVALZ VIN VOUT GND EN GND C1 C2 GND GND U1 R2 R1 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP170/ADP171. However, as can be seen from Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. J1 ANALOG DEVICES ADP170-x.x-EVALZ VIN VO UT GND EN GND C1 C2 GND GND U1 Figure 41. Example ADP171 PCB Layout Figure 40. Example ADP170 PCB Layout |
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