© 2013 Littelfuse, Inc.

Specifications are subject to change without notice.

Revised: 04/24/13

General Purpose ESD Protection - SP724 Series

Package Dimensions — Small Outline Transistor Plastic Packages (SOT23-6)

Time

25

time to peak temperature

Preheat

Preheat

Ramp-up

Ramp-up

Ramp-down

Ramp-do

Critical Zone

Critical Zone

Reflow Condition

Pb – Free assembly

Pre Heat

-Temperature Min (T

150°C

-Temperature Max (T

200°C

-Time (min to max) (t

60 – 180 secs

Average ramp up rate (Liquidus) Temp

(T

5°C/second max

T

5°C/second max

Reflow

-Temperature (T

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

Time within 5°C of actual peak

Temperature (t

20 – 40 seconds

Ramp-down Rate

5°C/second max

Time 25°C to peakTemperature (T

8 minutes Max.

Do not exceed

260°C

Soldering Parameters

Notes:

1. Dimensioning and tolerances per ANSI 14.5M-1982.

2. Package conforms to EIAJ SC-74 (1992).

3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.

4. Footlenth L measured at reference to seating plane.

5. “L” is the length of flat foot surface for soldering to substrate.

6. “N” is the number of terminal positions.

7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily

exact.

Package

SOT23-6

Pins

6

JEDEC

MO-178

Millimeters

Inches

Notes

Min

Max

Min

Max

A

0.900

1.450

0.035

0.057

-

A1

0.000

0.150

0.000

0.006

-

A2

0.900

1.300

0.035

0.051

-

b

0.350

0.500

0.0138

0.0196

-

C

0.080

0.220

0.0031

0.009

-

D

2.800

3.000

0.11

0.118

3

E

2.600

3.000

0.102

0.118

-

E1

1.500

1.750

0.06

0.069

3

e

0.95 Ref

0.0374 ref

-

e1

1.9 Ref

0.0748 Ref

-

L

0.100

0.600

0.004

0.023

4,5

N

6

6

6

a

0º

10º

0º

10º

-

M

2.590

0.102

-

O

0.690

.027 TYP

-

P

0.990

.039 TYP

-

R

0.950

0.038

-

O

P

R

M

Recommended Solder Pad Layout