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MPC8270VR датащи(PDF) 15 Page - Freescale Semiconductor, Inc

номер детали MPC8270VR
подробное описание детали  MPC8280 PowerQUICC II Family Hardware Specifications
PDF  83 Pages
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производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8270VR датащи(HTML) 15 Page - Freescale Semiconductor, Inc

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MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2
Freescale Semiconductor
15
Power Dissipation
5
Power Dissipation
This table provides preliminary, estimated power dissipation for various configurations. Note that suitable
thermal management is required to ensure the junction temperature does not exceed the maximum
specified value. Also note that the I/O power should be included when determining whether to use a heat
sink. For a complete list of possible clock configurations, see Section 7, “Clock Configuration Modes.”
Table 7. Estimated Power Dissipation for Various Configurations1
1 Test temperature = 105° C
Bus
(MHz)
CPM
Multiplication
Factor
CPM
(MHz)
CPU
Multiplication
Factor
CPU
(MHz)
PINT(W)
2,3
2 P
INT = IDD x VDD Watts
3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.45 W (nominal), 0.5 W (maximum)
83.3 MHz = 0.5W (nominal), 0.6 W (maximum)
100 MHz = 0.6 W (nominal), 0.7 W (maximum)
Vddl 1.5 Volts
Nominal
Maximum
66.67
2.5
166
3.5
233
0.95
1.0
66.67
2.5
166
4
266
1.0
1.05
66.67
3
200
4
266
1.05
1.1
66.67
3.5
233
4.5
300
1.05
1.15
83.33
3
250
4
333
1.25
1.35
83.33
3
250
4.5
375
1.3
1.4
83.33
3.5
292
5
417
1.45
1.55
100
3
300
4
400
1.5
1.6
100
3
300
4.5
450
1.55
1.65



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