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MPC8280 датащи(PDF) 75 Page - Freescale Semiconductor, Inc |
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MPC8280 датащи(HTML) 75 Page - Freescale Semiconductor, Inc |
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75 / 83 page ![]() MPC8280 PowerQUICC II Family Hardware Specifications, Rev. 2 Freescale Semiconductor 75 Package Description 9 Package Description This figure shows the side profile of the TBGA package to indicate the direction of the top surface view. Figure 15. Side View of the TBGA Package This figure shows the side profile of the PBGA package to indicate the direction of the top surface view. Figure 16. Side View of the PBGA Package Remove 3 Must be pulled down or left floating. 4 If PCI is not desired, must be pulled up or left floating. 5 Sphere is not connected to die. 6 GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in Section 4.6, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to GND with the noise filtering capacitors. 7 XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor. Soldermask Copper Traces Die Copper Heat Spreader (Oxidized for Insulation) 1.27 mm Pitch Glob-Top Dam Wire Bonds Etched Pressure Sensitive Die Glob-Top Filled Area Polymide Tape Cavity Adhesive Attach View Die Transfer molding compound 1 mm pitch Wire bonds attach DIE Ball bond Screen-printed solder mask Cu substrate traces Resin glass epoxy Plated substrate via |
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