SM6T

Characteristics

Doc ID 3082 Rev 9

5/10

Figure 6.

Capacitance versus reverse

applied voltage for unidirectional

types (typical values)

Figure 7.

Capacitance versus reverse applied

voltage for bidirectional types

(typical values)

C (pF)

10

100

1000

10000

1

10

100

1000

F=1 MHz

V

T

SM6T6V8A

SM6T15A

SM6T30A

SM6T68A

SM6T100A

SM6T220A

V(V)

R

C (pF)

10

100

1000

10000

1

10

100

1000

F=1 MHz

V

T

SM6T6V8CA

SM6T15CA

SM6T30CA

SM6T68CA

SM6T100CA

SM6T220CA

V(V)

R

Figure 8.

Peak forward voltage drop versus

peak forward current

(typical values)

Figure 9.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

0.0

0.5

1.0

1.5

2.0

2.5

3.0

I

T

T

Zth (j-a)/Rth (j-a)

0.01

0.10

1.00

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

1.0E+02

1.0E+03

Recommended pad layout

Printed circuit board FR4, copper thickness = 35 µm

s

tp

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under each lead

Figure 11.

Leakage current versus junction

temperature (typical values)

0

10

20

30

40

50

60

70

80

90

100

110

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(printed circuit board FR4,

copper thickness = 35 µm)

I

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

25

50

75

100

125

150

V

V

V

V

T (° C)

j