SPBT2532C2.AT2

Hardware design

Doc ID 023461 Rev 1

17/27

7

Hardware design

The SPBT2532C2.AT2 module with AT2 command embedded FW supports UAR and GPIO

hardware interfaces. Note that the usage of these interfaces is dependent upon the firmware

that is loaded into the module, and is beyond the scope of this document. The AT2

command interface uses the main UART by default.

Note:

1

All unused pins should be left floating; do not ground.

2

All GND pins must be well grounded.

3

The area around the module should be free of any ground planes, power planes, trace

routings, or metal, for 6 mm from the antenna in all directions.

4

Traces should not be routed underneath the module.

7.1

Module reflow installation

The SPB2532C2.AT2 is a surface mount Bluetooth module supplied on a 14-pin, 6-layer

PCB. The final assembly recommended reflow profiles are indicated here below.

The soldering phase must be executed with care: in order to avoid undesired melting

phenomenon, particular attention must be paid to the setup of the peak temperature.

The following are some suggestions for the temperature profile based on IPC/JEDEC J-

STD-020C, July 2004 recommendations.

Table 8.

Soldering

Profile feature

PB-free assembly

3 °C/sec max.

Preheat:

150 °C

200 °C

60-100 sec

Time maintained above:

217 °C

60-70 sec

240 + 0 °C

10-20 sec

Ramp-down rate

6 °C/sec

Time from 25 °C to peak temperature

8 minutes max.