Bond wires

Leads

Copper

Copper

Solder

Ceramic

DCB

Chip

Mould

part number

Vces

(V)

(a)

(V)

tfi typ

(ns)

Eoff typ

(mj)

rthjc

package

IXGP36N60A3

600

36

1.4

325

3

0.56

TO-220

IXGH36N60A3

600

36

1.4

325

3

0.56

TO-247

IXGH36N60A3D4

600

36

1.4

325

3

0.56

TO-247

IXGA36N60A3

600

36

1.4

325

3

0.56

TO-263

IXGR64N60A3

600

47

1.35

222

3.28

0.62

ISOPLUS247

IXGP48N60A3

600

48

1.35

224

2.9

0.42

TO-220

IXGH48N60A3

600

48

1.35

224

2.9

0.42

TO-247

IXGH48N60A3D1

600

48

1.35

224

2.9

0.42

TO-247

IXGA48N60A3

600

48

1.35

224

2.9

0.42

TO-263

IXGR72N60A3

600

52

1.35

250

3.5

0.62

ISOPLUS247

IXGR72N60A3U1

600

52

1.35

250

3.5

0.62

ISOPLUS247

IXGH64N60A3

600

64

1.35

222

3.28

0.27

TO-247

IXGT64N60A3

600

64

1.35

222

3.28

0.27

TO-268

IXGH72N60A3

600

72

1.35

250

3.5

0.23

TO-247

IXGH72N60A3

600

72

1.35

250

3.5

0.23

TO-247

IXGT72N60A3

600

72

1.35

250

3.5

0.23

TO-268

IXGX120N60A3

600

120

1.35

260

6.6

0.16

PLUS247

IXGN120N60A3

600

120

1.35

260

6.6

0.21

SOT-227B

IXGN120N60A3D1

600

120

1.35

260

6.6

0.21

SOT-227B

IXGK120N60A3

600

120

1.35

260

6.6

0.16

TO-264

IXGN320N60A3

600

170

1.25

740

na

0.17

SOT-227B

IXGN400N60A3

600

190

1.25

270

na

0.15

SOT-227

IXGX320N60A3

600

210

1.25

740

na

0.125

PLUS247

IXGK320N60A3

600

210

1.25

740

na

0.125

TO-264

The switching and conduction losses for the A3-Class are optimized for sub-5kHz switching frequency applications.

Performance improvements for this classification include up to a 16% reduction in saturation voltage Vce(sat) compared to

prior generation product.

Provides 2500V, UL recognized isolation with superior thermal performance (E153432).

ƒ

Improves termperature and power cycling capability.

ƒ

Cost effective clip mounting.

ƒ

* IXYS Patented Packages, Patent No. 6,404,065

* For information regarding IXYS ISoPLUS packages, visit http://www.ixys.com/IXAN0022.pdf