поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

MPC8250 датащи(PDF) 10 Page - Freescale Semiconductor, Inc

номер детали MPC8250
подробное описание детали  Hardware Specifications
PDF  62 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  FREESCALE [Freescale Semiconductor, Inc]
домашняя страница  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8250 датащи(HTML) 10 Page - Freescale Semiconductor, Inc

Back Button MPC8250 Datasheet HTML 6Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 7Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 8Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 9Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 10Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 11Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 12Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 13Page - Freescale Semiconductor, Inc MPC8250 Datasheet HTML 14Page - Freescale Semiconductor, Inc Next Button
Zoom Inzoom in Zoom Outzoom out
 10 / 62 page
background image
MPC8250 Hardware Specifications, Rev. 2
10
Freescale Semiconductor
Electrical and Thermal Characteristics
2.2
Thermal Characteristics
Table 4 describes thermal characteristics.
2.3
Power Considerations
The average chip-junction temperature, TJ, in °C can be obtained from the following:
TJ = TA + (PD x θJA)
(1)
where
TA = ambient temperature °C
θ
JA = package thermal resistance, junction to ambient, °C/W
PD = PINT + PI/O
PINT = IDD x VDD Watts (chip internal power)
PI/O = power dissipation on input and output pins (determined by user)
For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and
TJ is the following:
PD = K/(TJ + 273° C)
(2)
Solving equations (1) and (2) for K gives:
K = PD x (TA + 273° C) + θJA x PD
2
(3)
1
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
2
The leakage current is measured for nominal VDD, VCCSYN, and VDD.
Table 4. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
480 TBGA
516 PBGA
Junction to ambient—
single-layer board 1
1
Assumes no thermal vias
θJA
13
24
°C/W
Natural convection
10
18
1 m/s
Junction to ambient—
four-layer board
11
16
Natural convection
813
1 m/s
Junction to board 2
2
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
θJB
48
°C/W
Junction to case 3
3
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
θJC
1.1
6
°C/W



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com