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MCP1603 датащи(PDF) 13 Page - Microchip Technology |
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MCP1603 датащи(HTML) 13 Page - Microchip Technology |
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13 / 34 page ![]() 2007-2012 Microchip Technology Inc. DS22042B-page 13 MCP1603/B/L 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. 3.1 Power Supply Input Voltage Pin (VIN) Connect the input voltage source to VIN. The input source must be decoupled to GND with a 4.7 µF capacitor. 3.2 Ground Pin (GND) Ground pin for the device. The loop area of the ground traces should be kept as minimal as possible. 3.3 Shutdown Control Input Pin (SHDN) The SHDN pin is a logic-level input used to enable or disable the device. A logic high (>45% of VIN) will enable the regulator output. A logic low (<15% of VIN) will ensure that the regulator is disabled. 3.4 Feedback / Output Voltage Pin (VFB/VOUT) For adjustable output options, connect the center of the output voltage divider to the VFB/VOUT pin. For fixed- output voltage options, connect the output directly to the VFB/VOUT pin. 3.5 Switch Node, Buck Inductor Connection Pin (LX) Connect the LX pin directly to the buck inductor. This pin carries large signal-level current; all connections should be made as short as possible. 3.6 Exposed Metal Pad (EP) For the DFN package, connect the Exposed Pad to GND, with vias into the GND plane. This connection to the GND plane will aid in heat removal from the package. TABLE 3-1: PIN FUNCTION TABLE MCP1603/B TSOT-23 MCP1603L TSOT-23 MCP1603 2x 3 DFN Symbol Description 14 7 VIN Power Supply Input Voltage Pin 2 2 8 GND Ground Pin 3 1 3 SHDN Shutdown Control Input Pin 45 4 VFB/VOUT Feedback / Output Voltage Pin 53 1 LX Switch Node, Buck Inductor Connection Pin — — 2, 5, 6 NC No Connect — — Exposed Pad EP For the DFN package, the center exposed pad is a thermal path to remove heat from the device. Electrically, this pad is at ground potential and should be connected to GND. |
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