 2003-2012 Microchip Technology Inc.

DS21333C-page 19

TC1302A/B

8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN)

E2

D

Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not

Exposed Pad Width

Exposed Pad Length

Lead Length

*Controlling Parameter

Lead Width

Drawing No. C04-062

Notes:

Exposed pad dimensions vary with paddle size.

exceed .010" (0.254mm) per side.

Overall Width

D2

E2

L

b

D

.019

.012

.007

.047

.055

.010

.118 BSC

A1

Number of Pins

Standoff

Lead Thickness

Overall Length

Overall Height

Pitch

A

A3

p

n

Units

A

A1

E

A3

Dimension Limits

8

.000

.001

.008 REF.

.118 BSC

.031

.026 BSC

MIN

INCHES

NOM

TOP VIEW

EXPOSED

METAL

PAD

0.48

0.26

3.00 BSC

0.30

.022

.069

.015

.096

0.23

1.20

1.39

0.55

0.37

1.75

2.45

0.02

0.80

3.00 BSC

0.20 REF.

0.65 BSC

MILLIMETERS*

.002

.039

0.00

MIN

MAX

NOM

8

0.05

1.00

MAX

BOTTOM VIEW

2

1

ID INDEX

PIN 1

E

L

D2

p

b

n

3.

4.

Package may have one or more exposed tie bars at ends.

1.

AREA

Pin 1 visual index feature may vary, but must be located within the hatched area.

2.

(NOTE 2)

TIE BAR

(NOTE 1)

EXPOSED

0.90

.035

(Note 4)

(Note 4)

5. JEDEC equivalent: Pending

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging