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MCP2155 датащи(PDF) 41 Page - Microchip Technology |
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MCP2155 датащи(HTML) 41 Page - Microchip Technology |
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41 / 52 page ![]() 2001-2013 Microchip Technology Inc. Preliminary DS21690B-page 41 MCP2155 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 18-Lead PDIP (300 mil) Example: 18-Lead SOIC (300 mil) Example: 20-Lead SSOP (209 mil, 5.30 mm) Example: XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXYYWWNNN XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXYYWWNNN XXXXXXXXXXX XXXXXXXXXXX XXXYYWWNNN MCP2155I/SS XXXXXXXXXXX XXXYYWWNNN MCP2155-I/SO XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX XXXXXYYWWNNN MCP2155-I/P XXXXXXXXXXXXXXXXX XXXXXYYWWNNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 21690B.book Page 41 Thursday, January 10, 2013 1:06 PM |
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