SST12LF09

DS75083A-page 12

 2013 Microchip Technology Inc.

8.0

PACKAGING DIAGRAMS

FIGURE 8-1:

16-CONTACT SUPER-THIN QUAL FLAT NO-LEAD (XQFN)

PACKAGE CODE: Q3C

TABLE 8-1:

REVISION HISTORY

Revision

Description

Date

A

•

Initial release of data sheet

May 2013

Note: 1. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.

2. The topside pin #1 indicator is laser engraved; its approximate shape and location is as shown.

Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device.

4. Untoleranced dimensions are nominal target dimensions.

5. All linear dimensions are in millimeters (max/min).

16-x2qfn-2.5x2.5-Q3C-2.0

0.5 BSC

See notes

2 and 3

Pin #1

0.25

0.15

0.075

0.127

0.275

0.175

TOP VIEW

BOTTOM VIEW

SIDE VIEW

1 mm

2.50

± 0.05

2.50

± 0.05

Pin #1

(laser

engraved

see note 2)

1.35

1.35

0.40

0.34

0.05 Max