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16C84 датащи(PDF) 98 Page - Microchip Technology

номер детали 16C84
подробное описание детали  8-bit CMOS EEPROM Microcontroller
PDF  110 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

16C84 датащи(HTML) 98 Page - Microchip Technology

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PIC16C84
DS30445D-page 98
 1996-2013 Microchip Technology Inc.
13.2
K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
0.014
0.009
0.010
0.011
0.005
0.005
0.010
0.394
0.292
0.450
0.004
0.048
0.093
MIN
n
Number of Pins
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Chamfer Distance
Outside Dimension
Molded Package Width
Molded Package Length
Overall Pack. Height
Lead Thickness
Radius Centerline
Foot Angle
Foot Length
Gull Wing Radius
Shoulder Radius
Standoff
Shoulder Height
R2
R1
E1
A2
A1
X
B†
c
L1
L
E‡
D‡
A
Dimension Limits
Pitch
Units
p
18
18
0
0
12
12
15
15
4
0.020
0
0.017
0.011
0.015
0.016
0.005
0.005
0.407
0.296
0.456
0.008
0.058
0.099
0.029
0.019
0.012
0.020
0.021
0.010
0.010
8
0.419
0.299
0.462
0.011
0.068
0.104
0
0
12
12
15
15
0.42
0.27
0.38
0.41
0.13
0.13
0.50
10.33
7.51
11.58
0.19
1.47
2.50
0.25
0
0.36
0.23
0.25
0.28
0.13
0.13
10.01
7.42
11.43
0.10
1.22
2.36
0.74
48
0.48
0.30
0.51
0.53
0.25
0.25
10.64
7.59
11.73
0.28
1.73
2.64
INCHES*
0.050
NOM
MAX
1.27
MILLIMETERS
MIN
NOM
MAX
n
2
1
R2
R1
L1
L
c
X
45 °
D
p
B
E
E1
A1
A2
A
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging



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