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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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INTEDG датащи(PDF) 402 Page - Microchip Technology |
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INTEDG датащи(HTML) 402 Page - Microchip Technology |
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402 / 478 page  PIC16(L)F1946/47 DS41414D-page 402 2010-2012 Microchip Technology Inc. 30.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C TA +125°C Param No. Sym. Characteristic Typ. Units Conditions TH01 JA Thermal Resistance Junction to Ambient 48.3 C/W 64-pin TQFP package 28 C/W 64-pin QFN package TH02 JC Thermal Resistance Junction to Case 26.1 C/W 64-pin TQFP package 0.24 C/W 64-pin QFN package TH03 TJMAX Maximum Junction Temperature 150 C TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1) TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/ JA(2),(3) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature 3: TJ = Junction Temperature |
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