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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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SFH7773 датащи(PDF) 18 Page - OSRAM GmbH |
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SFH7773 датащи(HTML) 18 Page - OSRAM GmbH |
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18 / 23 page  the SFH 7773 and provides the necessary peak burst current. Typ. values are 100 nF || 4.7 µF at the VLED side (for up to 200 mA burst current) and 100 nF || 1.0 µF for the VDD circuit (ASIC supply). The 4.7 µF capacitor can be reduced if the LED burst circuit is reduced to lower levels, e.g. 50 mA. Fig. 18 illustrates an arrangement for a single sided pcb layout. Using a double sided pcb and placing the capacitors directly beneath the resp. pin is also recommended. The separation/decoupling of the VDD / VLED via separate ground pins provide the necessary stability during the high emitter current bursts (up to 200 mA peak, 667 kHz). Additionally it ensures the stability of the VDD circuit during the LED current bursts. Additionally the capacitors are necessary to isolate the sensor from other possible noise sources on the same power line and guarantee a low noise operation. This is especially important in a laboratory environment, if regulated power supplies are used, which often have poor pulse current capabilities – see recommendation above. Fig. 19 illustrates a recommendation for implementing the SFH 7773 into a mobile phone environment. The SCL, SDA and INT lines require pull-up resistors to the logic voltage (VIO). The limits for the logic levels are according to the I2C- bus specification (1.6 V to 2.0 V) [2]. The recommended value for Rp is 560 Ω (up to e.g. 10 kΩ). Please note the actual value of the pull-up resistor depends - among other issues - on the total load and communication speed of the I2C-bus. Fig. 19: Recommended implementation into a mobile phone environment. 20: Recommended soldering pad design. Fig. 20 presents a reference soldering-pad design. Please refer to the SFH 7773 datasheet for the most up-to-date recommendation. 11. Device Handling and Cleaning In order to protect the semiconductor chips from environmental influences, e.g. in the soldering environment, a tape based encapsulant is used. Since this tape is very elastic and soft, mechanical stress or damage to the tape should be avoided during processing/assembly. The tape must not be removed under any circumstances. Excessive force applied to the cover (tape) can lead to a spontaneous failure of the component (damage to the contacts). To prevent damaging or puncturing the tape, the use of all types of sharp objects should be avoided both in the laboratory and factory environments. Cleaning In general, OSRAM Opto Semiconductors does not recommend a wet cleaning process for components like the SFH 7773 as the package is not hermetically sealed. Due to the open design, all kind of cleaning liquids can infiltrate the package and cause December 12, 2011 page 18 of 23 |
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