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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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S891 датащи(PDF) 21 Page - EPCOS |
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S891 датащи(HTML) 21 Page - EPCOS |
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21 / 26 page  8 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked. b) Cracks When placing a component near an area which is apt to bend or a grid groove on the PC board, it is advisable to have both electrodes subjected to uniform stress, or to position the component's electrodes at right angles to the grid groove or bending line (see c) Component orientation). c) Component orientation Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Page 21 of 26 Please read Cautions and warnings and Important notes at the end of this document. |
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