Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Sn-Pb eutectic assembly

Pb-free assembly

Preheat and soak

- Temperature min

100

°C

150

°C

- Temperature max

150

°C

200

°C

- Time

60 ... 180 s

Average ramp-up rate

3

°C/ s max.

3

°C/ s max.

Liquidous temperature

183

°C

217

°C

Time at liquidous

60 ... 150 s

60 ... 150 s

Peak package body temperature

220

245

°C of specified

Average ramp-down rate

6

°C/ s max.

6

°C/ s max.

Time 25

°C to peak temperature

maximum 6 min

maximum 8 min

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Temperature measurement

B57560G, B57560G1

Glass-encapsulated sensors

G560/G1560

Page 13 of 22

Please read Cautions and warnings and

Important notes at the end of this document.