Reel packing

5.Suggested thermal profile for soldering process

1. Storage environment：Temperature=5~40℃ Humidity=55±25%

2. Reflow soldering of surface-mount device

3. Reflow soldering

LMBR220FT1G thru LMBR2200FT1G

SOD123-FL

7"

3,000

4.0

30,000

183*183*123

178

382*262*387

240,000

8.7

REEL DIA.

(mm)

CARTON SIZE

(mm)

CARTON

(PCS)

PACKAGE

REEL SIZE

REEL

(PCS)

APPOX.

GROSS WEIGHT

(kg)

COMPONENT

SPACING

(mm)

BOX

(pcs)

INNER BOX

(mm)

Profile Feature

Soldering Condition

<3℃/sec

Preheat

- Temperature Min(Tsmin)

- Temperature Max(Tsmax)

150℃

200℃

60~120sec

- Ramp-up Rate

<3sec

Time maintained above:

217℃

60-260sec

255 -0/+5℃

Time within 5℃ of actual Peak

10~30sec

Ramp-down Rate

<6℃/sec

Time 25℃ to Peak Temperature

<6minutes