Product Details

DIMENSION A

DIMENSION B

DIMENSION C

DIMENSION D

INTERFACE MATERIAL

FINISH

Notes:

Dimensions are measureD in millimeters

Dimensions a & B refer to component size

Dimension c = the height of the heat sink shown aBove anD Does not

incluDe the height of the attachment methoD

ats reserves the right to upDate or change it proDucts without

notice

contact ats to learn aBout custom options availaBle

1)

2)

3)

4)

5)

thermal Performance

For more information, to find a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

ATS PART # ATS-X53250P-C1-R0

Features & Benefits

High Performance BGA Cooling

Solutions with superGRIP™ Attachment

REV1_0908

AIR VELOCITy

THERMAL RESISTANCE

ft/min

m/s

°c/w (unDucteD flow)

°c/w (DucteD flow)

200

1.0

300

1.5

400

2.0

500

2.5

600

3.0

700

3.5

800

4.0

5.7

4.4

3.8

3.4

3.1

2.9

2.7

3.4

25 mm

25 mm

17.5 mm

25 mm

Blue anoDizeD

chomerics t-766

Designed for 25 x 25 mm Bga components

maximum performance from phase-changing tim and does not require

holes in the pcB

allows the heat sink to be detached and reattached without damaging the

component and/or the pcB, an important feature in the event a pcB may

need to be reworked

meets telcordia gr-63-core office vibration, etsi 300 019

transportation vibration, and mil-stD-810 shock testing and

unpackaged Drop testing standards

requires minimal space around the component’s perimeter; ideal for

densely populated pcBs

“keep-out” requirements: an “un-populated” boarder zone of 3 mm

around the component is necessary to facilitate the installation/removal of

the supergrip™. please refer to the supergrip™ keep-out guidelines

and supergrip™ installation/removal instructions for further details

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*Image above is for illustration purposes only.