4 Pad Ceramic Package, 2.5 mm x 3.2 mm

ILCX13 Series

12/20/12_E

Specifications subject to change without notice

Page 2

Pb Free Solder Reflow Profile:

Typical Circuit:

*Units are backward compatible with 240C reflow processes

Package Information:

MSL = 1

Termination = e4 (Au over Ni over W base metal).

Tape and Reel Information:

Environmental Specifications

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking

Line 1: I-Date Code (YWW)

Line 2: Frequency

Quantity per

Reel

1000

A

8.0+/-.2

B

4.0 +/-.2

C

3.5 +/-.2

D

16.5 +/-2

E

50 / 60 / 80

F

180